Transense Technologies strikes technology packaging deal with ISI
Transense Technologies PLC on Tuesday said it has signed a licensing supply agreement with a subsidiary of Illinois, US-based electronics firm Molex LLC to support the packaging of a product.
The Bicester, England-based sensor technology developer said it has struck the agreement with ISI Interconnect Systems to work on the packaging and distribution of its proprietary Saw Application Specific Integrated Circuit technology in the US.
Transense said the deal ‘marks a significant milestone’ in its expansion within the US defence and aerospace sectors.
ISI will carry out final device packaging at its advanced semiconductor facility in California. The packaged technology will then be supplied by ISI to end customers within the US.
Transense said the technology is a key component in Saw torque and temperature sensor systems and is often built into electronic control units.
‘This collaboration has been under development for over 12 months, and we are delighted to have it signed. Establishing an ASIC packaging solution within the US offers significant benefits to our customers there in terms of responsiveness, logistics, and overall supply chain security,’ said Transense Managing Director Ryan Maughan.
‘This end-to-end production flow within the USA, from wafer manufacturing, to dicing and final packaging, positions Transense to be able to respond more flexibly to demand from US customers and enhances the resilience of its supply chain at a critical time for global electronics production.’
Shares in Transense Technologies were up 7.2% to 134.00 pence in London on Tuesday afternoon.
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